everlight electronics co., ltd. http://www.everlight.com rev 2 page: 1 of 10 device no: dse-163-023 prepared date: 08-jan-2009 prepared by: betty lin technical data sheet 0402 package chip led (0.45 mm height) 16-213sygc/s530-xx/tr8 features ? package in 8mm tape on 7 diameter reel. ? compatible with automatic placement equipment. ? compatible with infrared and vapor phase reflow solder process. ? mono-color type. ? pb-free. ? the product itself will remain within rohs compliant version. descriptions ? the 16-213 smd led is much smaller than lead frame type components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained. ? besides, lightweight makes them ideal for miniature applications. etc. applications ? backlighting in dashboard and switch. ? telecommunication: indicator and backlighting in telephone and fax. ? flat backlight for lcd, switch and symbol. ? general use. device selection guide chip material emitted color resin color algainp brilliant yellow green water clear
16-213sygc/s530-xx/tr8 everlight electronics co., ltd. http://www.everlight.com rev 2 page: 2 of 10 device no: dse-163-023 prepared date: 08-jan-2009 prepared by: betty lin package outline dimensions note: the tolerances unless mentioned is 0.1mm ,unit = mm
16-213sygc/s530-xx/tr8 everlight electronics co., ltd. http://www.everlight.com rev 2 page: 3 of 10 device no: dse-163-023 prepared date: 08-jan-2009 prepared by: betty lin absolute maximum ratings (ta=25 ) parameter symbol rating unit reverse voltage v r 5 v forward current i f 25 ma peak forward current (duty 1/10 @1khz) i fp 60 ma power dissipation pd 60 mw electrostatic discharge(hbm) esd 2000 v operating temperature topr -40 ~ +85 storage temperature tstg -40 ~ +90 soldering temperature tsol reflow soldering : 260 for 10 sec. hand soldering : 350 for 3 sec.
16-213sygc/s530-xx/tr8 everlight electronics co., ltd. http://www.everlight.com rev 2 page: 4 of 10 device no: dse-163-023 prepared date: 08-jan-2009 prepared by: betty lin electro-optical characteristics (ta=25 ) parameter symbol *chip rank min. typ. max. unit condition e1 10 15 ----- e2 20 25 ----- e3 30 35 ----- luminous intensity iv e4 40 45 ----- mcd viewing angle 2 1/2 ----- ----- 120 ----- deg peak wavelength p ----- ----- 575 ----- nm dominant wavelength d ----- ----- 573 ----- nm spectrum radiation bandwidth ----- ----- 20 ----- nm forward voltage v f ----- 1.7 2.0 2.4 v i f =20ma reverse current i r ----- ----- ----- 10 a v r =5v *16-213sygc/s530-xx/tr8 chip rank
16-213sygc/s530-xx/tr8 everlight electronics co., ltd. http://www.everlight.com rev 2 page: 5 of 10 device no: dse-163-023 prepared date: 08-jan-2009 prepared by: betty lin typical electro-optical characteristics curves relative luminous intensity forward current derating curve forward current f i (ma) %) ( luminous intensity vs. ambient temperature relative luminous intensity %) ( forward current i (ma) f forward current i (ma) f spectrum distribution ta=25c forward current vs. forward voltage ta=25c wavelength (nm) f forward voltage v (v) forward current luminous intensity vs. ta=25c radiation diagram ta=25c relative luminous intensity (%) ambient temperature ta (c) ambient temperature ta (c)
16-213sygc/s530-xx/tr8 everlight electronics co., ltd. http://www.everlight.com rev 2 page: 6 of 10 device no: dse-163-023 prepared date: 08-jan-2009 prepared by: betty lin label explanation cat: luminous intensity rank hue: dom. wavelength rank ref: forward voltage rank reel dimensions note: the tolerances unless mentioned is 0.1mm ,unit = mm rohs pb cpn : p n : xxxxxxxxxxxxx xxxxxxxxxxxxx qty : xxx lot no : xxxxxxxxxx reference : xxxxxxxx cat : xxx hue : xxx ref : xxx everlight made in taiwan msl-2
16-213sygc/s530-xx/tr8 everlight electronics co., ltd. http://www.everlight.com rev 2 page: 7 of 10 device no: dse-163-023 prepared date: 08-jan-2009 prepared by: betty lin carrier tape dimensions: loaded quantity 3000 pcs per reel note: the tolerances unless mentioned is 0.1mm ,unit = mm moisture resistant packaging label desiccant label aluminum moisture-proof bag
16-213sygc/s530-xx/tr8 everlight electronics co., ltd. http://www.everlight.com rev 2 page: 8 of 10 device no: dse-163-023 prepared date: 08-jan-2009 prepared by: betty lin reliability test items and conditions the reliability of products shall be satisfied with items listed below. confidence level 90% ltpd 10% no. items test condition test hours/cycles sample size ac/re 1 reflow soldering temp. : 260 5 min. 5sec. 6 min. 22 pcs. 0/1 2 temperature cycle h : +100 15min 5 min l : -40 15min 300 cycles 22 pcs. 0/1 3 thermal shock h : +100 5min 10 sec l : -10 5min 300 cycles 22 pcs. 0/1 4 high temperature storage temp. : 100 1000 hrs. 22 pcs. 0/1 5 low temperature storage temp. : -40 1000 hrs. 22 pcs. 0/1 6 dc operating life i f = 20 ma 1000 hrs. 22 pcs. 0/1 7 high temperature / high humidity 85 / 85%rh 1000 hrs. 22 pcs. 0/1
16-213sygc/s530-xx/tr8 everlight electronics co., ltd. http://www.everlight.com rev 2 page: 9 of 10 device no: dse-163-023 prepared date: 08-jan-2009 prepared by: betty lin precautions for use 1. over-current-proof customer must apply resistors for protection, ot herwise slight voltage shift will cause big current change ( burn out will happen ). 2. storage 2.1 do not open moisture proof bag before the products are ready to use. 2.2 before opening the package: the leds should be kept at 30 or less and 90%rh or less. 2.3 after opening the package: the led's floor life is 1 year under 30 or less and 60% rh or less. if unused leds remain, it should be stored in moisture proof packages. 2.4 if the moisture absorbent material (silica gel) has faded away or the leds have exceeded the storage time, baking treatment should be performed using the following conditions. baking treatment : 60 5 for 24 hours. 3. soldering condition 3.1 pb-free solder temperature profile 120 sec. max. 1~5 c / sec. pre-heating 180~200c 60 sec. max. above 220c 260c. max. 10 sec. max. 1~5 c / sec. 3.2 reflow soldering should not be done more than two times. 3.3 when soldering, do not put stress on the leds during heating. 3.4 after soldering, do not warp the circuit board.
16-213sygc/s530-xx/tr8 everlight electronics co., ltd. http://www.everlight.com rev 2 page: 10 of 10 device no: dse-163-023 prepared date: 08-jan-2009 prepared by: betty lin 4.soldering iron each terminal is to go to the tip of soldering iron temperature less than 350 for 3 seconds within once in less than the soldering iron capacity 25w. leave two seconds and more intervals, and do soldering of each terminal. be careful because the da mage of the product is often started at the time of the hand solder. 5.repairing repair should not be done after the leds have been soldered. when repairing is unavoidable, a double-head soldering iron should be used (as below figure). it should be confirmed beforehand whether the characteristics of the leds will or will not be damaged by repairing.
|
